Institute for Material Science Research Publikationen
Development of copper and nickel based brazing solders with a low brazing and a high remelting temperature

Development of copper and nickel based brazing solders with a low brazing and a high remelting temperature

Categories Konferenz
Year 2016
Authors M. Schmieding, U. Holländer, K. Möhwald, H. J. Maier
Published in In: DVS (Hrsg.): Brazing, high temperature brazing and diffusion bonding - LÖT 2016. Aachen, 07.06. - 09.06.2016. DVS Media, 2016, S. 272-277