Thermal Spray Joining - Soldering and Filling of Aluminum Substrates under Atmospheric Conditions by a Combined Thermal Spray / Fusing Technique
| Categories |
Konferenz |
| Year | 2006 |
| Authors | Bach, Fr.-W.; Möhwald, K.; Drößler, B.; Kolar, D. |
| Published in | Tagungsband (als CD) zur ITSC 2006 Seattle. Materials Park, OH, USA: ASM International: CD, 2006. |
| ISBN | 0-87170-836-1 |
