ForschungPublikationen
Thermal Spray Joining - Soldering and Filling of Aluminum Substrates under Atmospheric Conditions by a Combined Thermal Spray / Fusing Technique

Thermal Spray Joining - Soldering and Filling of Aluminum Substrates under Atmospheric Conditions by a Combined Thermal Spray / Fusing Technique

Kategorien Konferenz
Jahr 2006
Autoren Bach, Fr.-W.; Möhwald, K.; Drößler, B.; Kolar, D.
Veröffentlicht in Tagungsband (als CD) zur ITSC 2006 Seattle. Materials Park, OH, USA: ASM International: CD, 2006.
ISBN 0-87170-836-1